Publication detail
| Reference | IEC 60749-14 ed1.0 |
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| Title | Versión Oficial En español - Dispositivos de semiconductores. Métodos de ensayo mecánicos y climáticos. Parte 14: Robustez de los terminales (integridad de los conectores). | |||||||||
| Publication date | 2003-08-07 | |||||||||
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| Abstract | Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user. | |||||||||
| Technical Committee | 47 - Semiconductor devices
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| Stability date | 2016 | |||||||||
| Work in progress |
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