| Reference |
IEC 60068-2-58 ed3.0 withdrawn corrigendum |
> preview
|
| Title |
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
|
| Publication date |
2004-07-15 |
Format, price
(Swiss francs)
and language |
 | 170.- |
| 24 pages |  | 170.- |
| 432 Kb |
|
| |
| Abstract |
Outlines test Td, applicable to surface mounting devices, which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead and for lead-free solder alloys.
Provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys and for determining the solderability, dissolution of metallization (see B.3.3) and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders. Include the solder bath method and reflow method.
|
| Technical Committee |
91 - Electronics assembly technology
|
| ICS Codes |
| 19.040 |
Environmental testing
*Including testing equipment
|
| 31.190 |
Electronic component assemblies
*Including preassembled modules |
|
| |
| Replaced by |
|
| Stability date |
2013 |
| |
| Work in progress |
|
Search
Quick access by ref. number
Basket
Payment
Just Published
Bestsellers