International Electrotechnical Commission

Publication detail

Reference	IEC 60749-30 ed1.0 withdrawn corrigendum	> preview
Title	Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
Publication date	2005-01-20
Format, price (Swiss francs) and language	60.- 27 pages 60.- 278 Kb
Abstract	Establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing in order to evaluate long term reliability.
Technical Committee	47 - Semiconductor devices
ICS Codes	31.080.01 Semiconductor devices in general
Replaced by
Stability date	2015
Work in progress	Project Stage code Forecast publication date No project under development - -

Search

>> Advanced search

Quick access by ref. number

Basket

Your basket is empty

Your country is :
Your TVA is : You must login...

Payment

Just Published

1. IEC 61970-301 Ed. 4.0
2. IEC 61996-1 Ed. 2.0
3. IEC 60974-5 Ed. 3.0
4. IEC 60601-1-SER Ed. 1.0
5. IEC 60601-1 Ed. 3.0
6. IEC 60838-2-1-am2 Ed. 1.0
7. IEC/TS 62720 Ed. 1.0

>> Published in the last 30 days

Bestsellers

1. IEC 61000-4-2 Ed. 2.0
2. IEC 62471 Ed. 1.0
3. IEC 60068-2-14 Ed. 6.0
4. IEC 60079-0 Ed. 6.0
5. IEC 61010-1 Ed. 3.0
6. IEC 61400-12-2 Ed. 1.0
7. IEC 62304 Ed. 1.0
8. IEC 60229 Ed. 3.0
9. IEC 60812 Ed. 2.0
10. IEC 61326-1 Ed. 2.0