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Publication detail

 
Reference IEC 60749-30 ed1.0 withdrawn corrigendum
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Title Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
Publication date 2005-01-20
Format, price
(Swiss francs)
and language
60.- 27 pages
60.- 278 Kb
 
Abstract Establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing in order to evaluate long term reliability.
Technical Committee 47 - Semiconductor devices  RSS
ICS Codes
31.080.01 Semiconductor devices in general
 
Replaced by
Stability date 2015
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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