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Reference IEC 62137 ed1.0 withdrawn corrigendum

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Title Corrigendum 1 - Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
Publication date 2005-01-27
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Abstract
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.190 Electronic component assemblies
*Including preassembled modules
 
Replaced by
Stability date 2013
 
Work in progress
ProjectStage codeForecast publication date
No project under development--

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