International Electrotechnical Commission

Publication detail

Reference	IEC 60068-2-58 ed3.0 withdrawn corrigendum	> preview
Title	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Publication date	2004-07-15
Format, price (Swiss francs) and language	170.- 53 pages 170.- 1560 Kb
Abstract	This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This standard provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys. This standard provides standard procedures for determining the solderability, dissolution of metallization and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders.
Technical Committee	91 - Electronics assembly technology
ICS Codes	19.040 Environmental testing *Including testing equipment 31.190 Electronic component assemblies *Including preassembled modules
Replaced by
Stability date	2013
Work in progress	Project Stage code Forecast publication date IEC 60068-2-58 Ed.4  3CD 2013-03-30

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