Publication detail
| Reference | IEC 60749-30 ed1.0 |
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| Title | Versión Oficial En español - Dispositivos semiconductores. Métodos de ensayo mecánicos y climáticos. Parte 30: Preacondicionamiento de dispositivos de montaje superficial no herméticos antes de su ensayo de fiabilidad. | |||||||||
| Publication date | 2005-01-20 | |||||||||
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| Abstract | Establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing in order to evaluate long term reliability. | |||||||||
| Technical Committee | 47 - Semiconductor devices
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| Stability date | 2015 | |||||||||
| Work in progress |
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