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Reference IEC 60068-2-58 ed3.0 withdrawn corrigendum

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Title Versión Oficial en Español - Ensayos ambientales. Parte 2-58: Ensayos. Ensayo Td: Métodos de ensayo de soldabilidad, resistencia de la metalización a la disolución y resistencia de los componentes para montaje en superficie (CMS) al calor de la soldadura.
Publication date 2005-02-23
Format, price
(Swiss francs)
and language
170.- 53 pages
170.- 618 Kb
 
Abstract This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This standard provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys. This standard provides standard procedures for determining the solderability, dissolution of metallization and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
19.040 Environmental testing
*Including testing equipment

31.190 Electronic component assemblies
*Including preassembled modules
 
Replaced by
Stability date 2017
 
Work in progress
ProjectStage codeForecast publication date
IEC 60068-2-58 Ed.4  RDIS2015-03-31


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