Publication detail
| Reference | IEC 60068-2-58 ed3.0 |
no preview |
||||||||
| Title | Versión Oficial en Español - Ensayos ambientales. Parte 2-58: Ensayos. Ensayo Td: Métodos de ensayo de soldabilidad, resistencia de la metalización a la disolución y resistencia de los componentes para montaje en superficie (CMS) al calor de la soldadura. | |||||||||
| Publication date | 2005-02-23 | |||||||||
| Format, price (Swiss francs) and language |
|
|||||||||
| Abstract | This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This standard provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys. This standard provides standard procedures for determining the solderability, dissolution of metallization and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders. | |||||||||
| Technical Committee | 91 - Electronics assembly technology
|
|||||||||
| ICS Codes |
|
|||||||||
| Stability date | 2013 | |||||||||
| Work in progress |
|
|||||||||
Search
Quick access by ref. number
Basket
| Your basket is empty |
Payment
| Accepted credit cards: | |
 | Prices in CHF (Swiss francs) |
| Request a pro forma to pay by bank transfer or cheque | |
| Learn how to share your publications with your colleagues, using networking options | |
Just Published
- IEC 60601-1-SER Ed. 1.0
- IEC 60601-1 Ed. 3.0
- IEC 60838-2-1-am2 Ed. 1.0
- IEC/TS 62720 Ed. 1.0
- IEC/TR 62655 Ed. 1.0
- IEC 61710 Ed. 2.0
- IEC 60099-5 Ed. 2.0
>> Published in the last 30 days
Bestsellers