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Reference IEC 60068-2-54 ed2.0 withdrawn corrigendum
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Title Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
Publication date 2006-04-27
Format, price
(Swiss francs)
and language
100.- 18 pages
100.- 341 Kb
 
Abstract Outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. It provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
19.040 Environmental testing
*Including testing equipment

31.020 Electronic components in general
*Magnetic components, see 29.100.10
 
Replaced by
Stability date 2015
 
Work in progress
ProjectStage codeForecast publication date
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