International Electrotechnical Commission

Publication detail

Reference	IEC 60068-2-54 ed2.0 withdrawn corrigendum	> preview
Title	Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
Publication date	2006-04-27
Format, price (Swiss francs) and language	100.- 18 pages 100.- 341 Kb
Abstract	Outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. It provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.
Technical Committee	91 - Electronics assembly technology
ICS Codes	19.040 Environmental testing *Including testing equipment 31.020 Electronic components in general *Magnetic components, see 29.100.10
Replaced by
Stability date	2015
Work in progress	Project Stage code Forecast publication date IEC 60068-2-54 fF Ed.2  BPUB 2013-05-06

Search

>> Advanced search

Quick access by ref. number

Basket

Your basket is empty

Your country is :
Your TVA is : You must login...

Payment

Just Published

1. Project IEC 62680-1 Ed. 1.0
2. Project IEC 61435 Ed. 2.0
3. Project IEC 61970-452 Ed. 1.0
4. Project IEC 62128-1 Ed. 2.0
5. Project IEC 62128-2 Ed. 2.0
6. Project IEC 62128-3 Ed. 1.0
7. Project IEC 62443-3-3 Ed. 1.0

>> Published in the last 30 days

Bestsellers

1. IEC 60529 Ed. 2.1
2. IEC 61000-4-2 Ed. 2.0
3. IEC 62471 Ed. 1.0
4. IEC 60068-2-14 Ed. 6.0
5. IEC 60079-0 Ed. 6.0
6. IEC 60812 Ed. 2.0
7. IEC 61010-1 Ed. 3.0
8. IEC 61400-12-2 Ed. 1.0
9. IEC 60068-2-78 Ed. 2.0
10. IEC 61326-1 Ed. 2.0