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Publication detail

 
Reference IEC 61189-2 ed2.0 withdrawn corrigendum
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Title Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Publication date 2006-05-30
Format, price
(Swiss francs)
and language
280.- 122 pages
280.- 1228 Kb
 
Abstract Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.180 Printed circuits and boards
 
Replaced by
Stability date 2013
 
Work in progress
ProjectStage codeForecast publication date
No project under development--

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