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Publication detail

 
Reference IEC 60749-35 ed1.0 withdrawn corrigendum
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Title Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
Publication date 2006-07-18
Format, price
(Swiss francs)
and language
130.- 43 pages
130.- 750 Kb
 
Abstract Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.
Technical Committee 47 - Semiconductor devices  RSS
ICS Codes
31.080.01 Semiconductor devices in general
 
Replaced by
Stability date 2016
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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