| Reference |
IEC 61189-6 ed1.0 withdrawn corrigendum |
 > preview
|
| Title |
Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
|
| Publication date |
2006-07-24 |
Format, price (Swiss francs) and language |
 | 230.- |
| 41 pages |  | 230.- |
| 605 Kb |
|
| |
| Abstract |
Provides a catalogue of test methods representing methodologies andprocedures that can be applied to materials used in manufacturing electronic assemblies.
|
| Technical Committee |
91 - Electronics assembly technology
|
| ICS Codes |
| 31.180 |
Printed circuits and boards |
|
| |
| Replaced by |
|
| Stability date |
2015 |
| |
| Work in progress |
| Project | Stage code | Forecast publication date |
|---|
| No project under development | - | - |
|