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Publication detail

 
Reference IEC 62047-2 ed1.0 withdrawn corrigendum
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Title Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
Publication date 2006-08-15
Format, price
(Swiss francs)
and language
50.- 25 pages
50.- 449 Kb
 
Abstract Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.
Technical Committee 47F - Micro-electromechanical systems  RSS
ICS Codes
31.080.99 Other semiconductor devices
 
Replaced by
Stability date 2015
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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