International Electrotechnical Commission

Publication detail

Reference	IEC 62047-2 ed1.0 withdrawn corrigendum	> preview
Title	Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
Publication date	2006-08-15
Format, price (Swiss francs) and language	50.- 25 pages 50.- 449 Kb
Abstract	Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.
Technical Committee	47F - Micro-electromechanical systems
ICS Codes	31.080.99 Other semiconductor devices
Replaced by
Stability date	2015
Work in progress	Project Stage code Forecast publication date No project under development - -

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