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Publication detail

 
Reference IEC 62047-3 ed1.0 withdrawn corrigendum
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Title Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
Publication date 2006-08-15
Format, price
(Swiss francs)
and language
30.- 15 pages
30.- 334 Kb
 
Abstract Specifies a standard test piece, which is used to guarantee the propriety and accuracy of a tensile testing system for thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for microelectromechanical systems (MEMS), micromachines and similar devices. It is based on such a concept that a tensile testing system can be guaranteed in propriety and accuracy, when the measured tensile strengths of the standard test pieces, whose tensile strength is pre-determined, are within the designated range. It also specifies the test pieces to minimize characteristics deviation among the pieces.
Technical Committee 47F - Micro-electromechanical systems  RSS
ICS Codes
31.080.99 Other semiconductor devices
 
Replaced by
Stability date 2015
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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