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Publication detail

 
Reference P-IEC/PAS 62483 ed1.0 withdrawn corrigendum
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Title Test method for measuring whisker growth on tin and tin alloy surface finishes
Publication date 2006-09-12
Format, price
(Swiss francs)
and language
170.- 27 pages
170.- 1863 Kb
 
Abstract Provides the methodology applicable for studying tin whisker growth from finishes containing a predominance of tin (Sn). This test method may not be sufficient for applications with special requirements, e.g., military or aerospace. Additional requirements may be specified in the appropriate requirements document
Technical Committee 47 - Semiconductor devices  RSS
ICS Codes
31.080.01 Semiconductor devices in general
 
Replaced by IEC 62483 ed1.0 (2013-09)
 

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