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Reference IEC/TR 60068-3-12 ed1.0 withdrawn corrigendum
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Title Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
Publication date 2007-03-12
Format, price
(Swiss francs)
and language
70.- 16 pages
70.- 1365 Kb
 
Abstract Presents two approaches to establish a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. The presented process window covers a great variety of electronic products, including a large range of package sizes (molded active electronic components, passive components and electromechanical components)
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
19.040 Environmental testing
*Including testing equipment
 
Replaced by
Stability date 2013
 
Work in progress
ProjectStage codeForecast publication date
No project under development--

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