| Reference |
IEC 61760-2 ed2.0 withdrawn corrigendum |
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|
| Title |
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
|
| Publication date |
2007-04-24 |
Format, price
(Swiss francs)
and language |
 | 35.- |
| 9 pages |  | 35.- |
| 192 Kb |
|
| |
| Abstract |
Describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)
This standard was updated and editorially revised. Specific reference is made to:
IEC/TS 61340-5-1: Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
IEC/TS 61340-5-2: Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
For convenience of the reader, an informative Annex A was added, which contains information about the climatic and mechanical conditions during transportation and storage (extracted from IEC 60721-3-1 and IEC 60721-3-2).
|
| Technical Committee |
91 - Electronics assembly technology
|
| ICS Codes |
| 31.020 |
Electronic components in general
*Magnetic components, see 29.100.10 |
|
| |
| Replaced by |
|
| Stability date |
2015 |
| |
| Work in progress |
| Project | Stage code | Forecast publication date |
|---|
| No project under development | - | - |
|
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