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Publication detail

 
Reference IEC 61760-2 ed2.0 withdrawn corrigendum
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Title Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
Publication date 2007-04-24
Format, price
(Swiss francs)
and language
35.- 9 pages
35.- 192 Kb
 
Abstract Describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.) This standard was updated and editorially revised. Specific reference is made to: IEC/TS 61340-5-1: Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements IEC/TS 61340-5-2: Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide For convenience of the reader, an informative Annex A was added, which contains information about the climatic and mechanical conditions during transportation and storage (extracted from IEC 60721-3-1 and IEC 60721-3-2).
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.020 Electronic components in general
*Magnetic components, see 29.100.10
 
Replaced by
Stability date 2015
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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