| Reference |
IEC 60191-1 ed2.0 withdrawn corrigendum |
 > preview
|
| Title |
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
|
| Publication date |
2007-04-24 |
Format, price (Swiss francs) and language |
 | 210.- |
| 39 pages |  | 210.- |
| 1112 Kb |
|
| |
| Abstract |
Gives guidelines on the preparation of outline drawings of discrete devices. For preparation of outline drawings of surface mounted discrete devices, IEC 60191-6 should be referred to as well.
The main changes from the previous edition are as follows:
- requirement added for SI-dimensions for new drawings to be published;
- former rules concerning inch-dimensions are given in an informative annex;
- former rules for coding are given in an informative annex;
- incorporation of the supplements;
- updating of references;
- restructuring and renumbering.
|
| Technical Committee |
47D - Semiconductor devices packaging
|
| ICS Codes |
|
| |
| Replaced by |
|
| Stability date |
2014 |
| |
| Work in progress |
| Project | Stage code | Forecast publication date |
|---|
| No project under development | - | - |
|