International Electrotechnical Commission

Publication detail

Reference	IEC 61190-1-2 ed2.0 withdrawn corrigendum	> preview
Title	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Publication date	2007-04-26
Format, price (Swiss francs) and language	100.- 18 pages 100.- 915 Kb
Abstract	Specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. Serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. Related information on flux characterization, quality control and procurement documentation for solder flux and flux containing material may be found in IEC 61190-1-1. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.
Technical Committee	91 - Electronics assembly technology
ICS Codes	31.190 Electronic component assemblies *Including preassembled modules
Replaced by
Stability date	2013
Work in progress	Project Stage code Forecast publication date IEC 61190-1-2 Amd.1 Ed.2  CCDV 2013-09-16

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