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Reference P-IEC 61190-1-2 ed2.0 withdrawn corrigendum
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Title Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Publication date 2007-04-26
Format, price
(Swiss francs)
and language
100.- 18 pages
100.- 928 Kb
 
Abstract Specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. Serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. Related information on flux characterization, quality control and procurement documentation for solder flux and flux containing material may be found in IEC 61190-1-1. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.190 Electronic component assemblies
*Including preassembled modules
 
Replaced by
 

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