Publication detail

Reference

IEC/PAS 61249-3-1 ed1.0

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Title

Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)

Publication date

2007-05-30

Format, price
(Swiss francs)
and language

	190.-		31 pages
	190.-		376 Kb

Abstract

Specifies the properties of copper-clad laminates used for flexible printed wiring boards for both adhesive and non-adhesive types

Technical Committee

91 - Electronics assembly technology

ICS Codes

31.180

Printed circuits and boards

Stability date

2013

Work in progress

Project	Stage code	Forecast publication date
No project under development	-	-

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