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Publication detail

 
Reference IEC/PAS 61249-3-1 ed1.0 withdrawn corrigendum
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Title Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
Publication date 2007-05-30
Format, price
(Swiss francs)
and language
190.- 31 pages
190.- 376 Kb
 
Abstract Specifies the properties of copper-clad laminates used for flexible printed wiring boards for both adhesive and non-adhesive types
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.180 Printed circuits and boards
 
Replaced by
Stability date 2013
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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