International Electrotechnical Commission

Publication detail

Reference	P-IEC 60286-3 ed4.0 withdrawn corrigendum	> preview
Title	Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
Publication date	2007-06-06
Format, price (Swiss francs) and language	170.- 28 pages 170.- 483 Kb
Abstract	It is applicable to the tape packaging of electronic components without leads or with lead stumps which are intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. It also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). It contains the following significant technical changes with respect to the previous edition: a) implementation of Type IV (adhesive-backed punched plastic carrier tape for singulated bare die and other surface mount components); b) minor revisions related to tables, figures and references.
Technical Committee	40 - Capacitors and resistors for electronic equipment
ICS Codes	31.020 Electronic components in general *Magnetic components, see 29.100.10 31.240 Mechanical structures for electronic equipment
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