International Electrotechnical Commission

Publication detail

Reference	IEC 60191-6-13 ed1.0 withdrawn corrigendum	> preview
Title	Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
Publication date	2007-06-27
Format, price (Swiss francs) and language	60.- 15 pages 60.- 261 Kb
Abstract	This part of IEC 60191 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ("FBGA" hereafter) and Fine-pitch Land Grid Array ("FLGA" hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.
Technical Committee	47D - Semiconductor devices packaging
ICS Codes	31.080.01 Semiconductor devices in general
Replaced by
Stability date	2017
Work in progress	Project Stage code Forecast publication date IEC 60191-6-13 Ed.2  1CD 2014-12-31

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