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Reference IEC 62137-1-1 ed1.0 withdrawn corrigendum
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Title Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
Publication date 2007-07-11
Format, price
(Swiss francs)
and language
70.- 15 pages
70.- 295 Kb
 
Abstract The test method described in this part of IEC 62137 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.190 Electronic component assemblies
*Including preassembled modules
 
Replaced by
Stability date 2017
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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