International Electrotechnical Commission

Publication detail

Reference	IEC 62137-1-2 ed1.0 withdrawn corrigendum	> preview
Title	Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
Publication date	2007-07-25
Format, price (Swiss francs) and language	80.- 17 pages 80.- 299 Kb
Abstract	The test method is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.
Technical Committee	91 - Electronics assembly technology
ICS Codes	31.190 Electronic component assemblies *Including preassembled modules
Replaced by
Stability date	2014
Work in progress	Project Stage code Forecast publication date No project under development - -

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