IEC > Webstore > Search > Register > Check out > Payment > Order confirmation

Publication detail

Reference IEC 62137-1-2 ed1.0 withdrawn corrigendum
> preview
Title Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
Publication date 2007-07-25
Format, price
(Swiss francs)
and language
80.- 17 pages
80.- 299 Kb
Abstract The test method is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.190 Electronic component assemblies
*Including preassembled modules
Replaced by
Stability date 2018
Work in progress
ProjectStage codeForecast publication date
No project under development--


>> Advanced search

Quick access by ref. number


Your basket is empty
Your country is :
Your TVA is : You must login...


Accepted credit cards:
Prices in CHF (Swiss francs)
Request a pro forma to pay by bank transfer or cheque
Learn how to share your publications with your colleagues, using networking options
Prices in CHF (Swiss francs)
We accept the following credit cards:
To pay by bank transfer: request a pro forma
If you purchase regularly through the IEC Webstore you can open a corporate account

Just Published

>> Published in the last 30 days


  1. IEC 60601-1-2 Ed. 4.0
  2. IEC 61010-1 Ed. 3.0
  3. IEC 60601-1 Ed. 3.1
  4. IEC 61000-4-5 Ed. 3.0
  5. IEC 61000-4-2 Ed. 2.0
  6. IEC 60079-0 Ed. 6.0
  7. IEC 62366-1 Ed. 1.0
  8. IEC 61508-3 Ed. 2.0
  9. IEC 60060-1 Ed. 3.0
  10. IEC 60079-14 Ed. 5.0