International Electrotechnical Commission

Publication detail

Reference	IEC/TR 62258-7 ed1.0 withdrawn corrigendum	> preview
Title	Semiconductor die products - Part 7: XML schema for data exchange
Publication date	2007-08-23
Format, price (Swiss francs) and language	170.- 26 pages 170.- 848 Kb
Abstract	This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers, singulated bare die, die and wafers attached connection structures and minimally or partially encapsulated die and wafers. This report contains an XML schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and IEC 62258-6, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC/TR 62258-4.
Technical Committee	47 - Semiconductor devices
ICS Codes	31.080.99 Other semiconductor devices
Replaced by
Stability date	2015
Work in progress	Project Stage code Forecast publication date No project under development - -

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