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Publication detail

 
Reference IEC 61189-3 ed2.0 withdrawn corrigendum
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Title Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
Publication date 2007-10-09
Format, price
(Swiss francs)
and language
310.- 118 pages
310.- 4806 Kb
 
Abstract Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. The major changes with regard to the previous edition concern the addition of 25 new test methods and the deletion of Annex B.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.180 Printed circuits and boards
 
Replaced by
Stability date 2013
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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