International Electrotechnical Commission

Publication detail

Reference	IEC 61189-3 ed2.0 withdrawn corrigendum	> preview
Title	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
Publication date	2007-10-09
Format, price (Swiss francs) and language	310.- 118 pages 310.- 4806 Kb
Abstract	Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. The major changes with regard to the previous edition concern the addition of 25 new test methods and the deletion of Annex B.
Technical Committee	91 - Electronics assembly technology
ICS Codes	31.180 Printed circuits and boards
Replaced by
Stability date	2013
Work in progress	Project Stage code Forecast publication date No project under development - -

Search

>> Advanced search

Quick access by ref. number

Basket

Your basket is empty

Your country is :
Your TVA is : You must login...

Payment

Just Published

1. Project IEC 62680-1 Ed. 1.0
2. Project IEC 61435 Ed. 2.0
3. Project IEC 61970-452 Ed. 1.0
4. Project IEC 62128-1 Ed. 2.0
5. Project IEC 62128-2 Ed. 2.0
6. Project IEC 62128-3 Ed. 1.0
7. Project IEC 62443-3-3 Ed. 1.0

>> Published in the last 30 days

Bestsellers

1. IEC 60529 Ed. 2.1
2. IEC 61000-4-2 Ed. 2.0
3. IEC 61010-1 Ed. 3.0
4. IEC 62471 Ed. 1.0
5. IEC 60068-2-14 Ed. 6.0
6. IEC 60079-0 Ed. 6.0
7. IEC 60812 Ed. 2.0
8. IEC 60068-2-30 Ed. 3.0
9. IEC 60068-2-78 Ed. 2.0
10. IEC 61326-1 Ed. 2.0