Publication detail
| Reference | IEC 60068-2-54 ed2.0 |
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| Title | Versión Oficial En español - Ensayos ambientales. Parte 2-54: Ensayos. Ensayo Ta: Ensayo de soldabilidad de componentes electrónicos por el método de la balanza de mojado | |||||||||
| Publication date | 2006-04-27 | |||||||||
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| Abstract | Outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. It provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. | |||||||||
| Technical Committee | 91 - Electronics assembly technology
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| Stability date | 2015 | |||||||||
| Work in progress |
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