IEC > Webstore > Search > Register > Check out > Payment > Order confirmation

Publication detail

 
Reference IEC 61188-5-4 ed1.0 withdrawn corrigendum
> preview
Title Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
Publication date 2007-10-30
Format, price
(Swiss francs)
and language
70.- 15 pages
70.- 874 Kb
 
Abstract Provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.180 Printed circuits and boards
 
Replaced by
Stability date 2014
 
Work in progress
ProjectStage codeForecast publication date
No project under development--

Search

>> Advanced search

Quick access by ref. number



Basket

Your basket is empty
 Your country is :
Your TVA is : You must login...

Payment

Accepted credit cards:
Prices in CHF (Swiss francs)
Request a pro forma to pay by bank transfer or cheque
Learn how to share your publications with your colleagues, using networking options
Prices in CHF (Swiss francs)
We accept the following credit cards:
To pay by bank transfer: request a pro forma
If you purchase regularly through the IEC Webstore you can open a corporate account

Just Published

>> Published in the last 30 days

Bestsellers

  1. IEC 61010-1 Ed. 3.0
  2. IEC 61000-4-2 Ed. 2.0
  3. IEC 62304 Ed. 1.0
  4. IEC 62471 Ed. 1.0
  5. IEC 60079-0 Ed. 6.0
  6. IEC 60601-1 Ed. 3.1
  7. IEC 60812 Ed. 2.0
  8. IEC 61400-12-2 Ed. 1.0
  9. IEC 60068-2-30 Ed. 3.0
  10. IEC 60529 Ed. 2.1