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Publication detail

 
Reference IEC 61188-5-4 ed1.0 withdrawn corrigendum
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Title Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
Publication date 2007-10-30
Format, price
(Swiss francs)
and language
70.- 15 pages
70.- 874 Kb
 
Abstract Provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.180 Printed circuits and boards
 
Replaced by
Stability date 2014
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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