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Publication detail

 
Reference IEC 60749-37 ed1.0 withdrawn corrigendum
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Title Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
Publication date 2008-01-30
Format, price
(Swiss francs)
and language
100.- 39 pages
100.- 1082 Kb
 
Abstract Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.
Technical Committee 47 - Semiconductor devices  RSS
ICS Codes
31.080.01 Semiconductor devices in general
 
Replaced by
Stability date 2016
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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