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Publication detail

 
Reference IEC 61760-2 ed2.0 withdrawn corrigendum
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Title Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
Publication date 2007-04-24
Format, price
(Swiss francs)
and language
35.- 17 pages
35.- 895 Kb
 
Abstract IEC 61760-2:2007 describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive (Conditions for printed boards are not taken into consideration). The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning". This second edition cancels and replaces the first edition, published in 1998, and constitutes a technical revision. The standard was updated and editorially revised.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.240 Mechanical structures for electronic equipment
 
Replaced by
Stability date 2015
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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