International Electrotechnical Commission

Publication detail

Reference	IEC 62137-1-1 ed1.0 withdrawn corrigendum	> preview
Title	Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
Publication date	2007-07-11
Format, price (Swiss francs) and language	70.- 30 pages 70.- 1035 Kb
Abstract	The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.
Technical Committee	91 - Electronics assembly technology
ICS Codes	31.190 Electronic component assemblies *Including preassembled modules
Replaced by
Stability date	2014
Work in progress	Project Stage code Forecast publication date No project under development - -

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