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Reference IEC 62137-1-2 ed1.0 withdrawn corrigendum
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Title Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
Publication date 2007-07-25
Format, price
(Swiss francs)
and language
80.- 33 pages
80.- 1055 Kb
 
Abstract The test method described in IEC 62137-1-2:2007 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.190 Electronic component assemblies
*Including preassembled modules
 
Replaced by
Stability date 2017
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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