International Electrotechnical Commission

Publication detail

Reference	IEC 61190-1-2 ed2.0 withdrawn corrigendum	> preview
Title	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Publication date	2007-04-26
Format, price (Swiss francs) and language	100.- 37 pages 100.- 1680 Kb
Abstract	IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.
Technical Committee	91 - Electronics assembly technology
ICS Codes	31.190 Electronic component assemblies *Including preassembled modules
Replaced by
Stability date	2013
Work in progress	Project Stage code Forecast publication date IEC 61190-1-2 Amd.1 Ed.2  CCDV 2013-09-16

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