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Reference IEC 60068-2-69 ed2.0 withdrawn corrigendum

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Title Versión Oficial En español - Ensayos ambientales. Parte 2-69: Ensayos. Ensayo Te: Ensayo de soldabilidad de componentes electrónicos para los dispositivos de montaje en superficie (SMD) por el método de equilibrado humectante
Publication date 2007-05-29
Format, price
(Swiss francs)
and language
150.- 50 pages
150.- 315 Kb
 
Abstract IEC 60068-2-69:2007 outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices. IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This second edition cancels and replaces the first edition published in 1995 and constitutes a technical revision. The main changes from the previous edition are as follows:
- Inclusion of lead-free alloy test conditions;
- Inclusion of new fluxes for testing, reflecting development of fluxes that have happened in the industry in the past 20 years;
- Inclusion of new component types, and updating test parameters for the whole component list.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
19.040 Environmental testing
*Including testing equipment

31.190 Electronic component assemblies
*Including preassembled modules
 
Replaced by
Stability date 2017
 
Work in progress
ProjectStage codeForecast publication date
IEC 60068-2-69 Ed.3  1CD2016-12-31


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