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Publication detail

 
Reference IEC 60191-6-13 ed1.0 withdrawn corrigendum
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Title Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
Publication date 2007-06-27
Format, price
(Swiss francs)
and language
60.- 29 pages
60.- 1070 Kb
 
Abstract IEC 60191-6-13:2007 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ("FBGA" hereafter) and Fine-pitch Land Grid Array ("FLGA" hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.
Technical Committee 47D - Semiconductor devices packaging  RSS
ICS Codes
31.080.01 Semiconductor devices in general
 
Replaced by
Stability date 2014
 
Work in progress
ProjectStage codeForecast publication date
IEC 60191-6-13 Ed.2  ADIS2015-07-12


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