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Reference IEC 60749-20 ed2.0 withdrawn corrigendum
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Title Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Publication date 2008-12-09
Format, price
(Swiss francs)
and language
170.- 53 pages
170.- 1786 Kb
 
Abstract IEC 60749-20:2008 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This second edition cancels and replaces the first edition published in 2002 and constitutes a technical revision. The main changes are as follows:
- to reconcile certain classifications of IEC 60749-20 and those of IPC/JEDEC J-STD-020C;
- reference IEC 60749-35 instead of Annex A of IEC 60749-20, Edition 1;
- update for lead-free solder;
- correct certain errors in the original Edition 1.
Technical Committee 47 - Semiconductor devices  RSS
ICS Codes
31.080.01 Semiconductor devices in general
 
Replaced by
Stability date 2016
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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