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Reference IEC 62137-1-4 ed1.0 withdrawn corrigendum
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Title Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
Publication date 2009-01-26
Format, price
(Swiss francs)
and language
50.- 25 pages
50.- 1037 Kb
 
Abstract The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.190 Electronic component assemblies
*Including preassembled modules
 
Replaced by
Stability date 2017
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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