International Electrotechnical Commission

Publication detail

Reference	IEC 62137-1-4 ed1.0 withdrawn corrigendum	> preview
Title	Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
Publication date	2009-01-26
Format, price (Swiss francs) and language	50.- 25 pages 50.- 1037 Kb
Abstract	The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.
Technical Committee	91 - Electronics assembly technology
ICS Codes	31.190 Electronic component assemblies *Including preassembled modules
Replaced by
Stability date	2014
Work in progress	Project Stage code Forecast publication date No project under development - -

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