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Reference IEC 62047-6 ed1.0 withdrawn corrigendum
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Title Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
Publication date 2009-04-07
Format, price
(Swiss francs)
and language
70.- 30 pages
70.- 1016 Kb
 
Abstract IEC 62047-6:2009 specifies the method for axial tensile-tensile force fatigue testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 µm and 10 µm under constant force range or constant displacement range. Thin films are used as main structural materials for MEMS and micromachines. The main structural materials for MEMS, micromachines, etc., have special features, such as typical dimensions of a few microns, material fabrication by deposition, andtest piece fabrication by means of non-mechanical machining, including photolithography. This International Standard specifies the axial force fatigue testing methods for micro-sized smooth specimens, which enables a guarantee of accuracy corresponding to the special features. The tests are carried out at room temperatures, in air, with loading applied to the test piece along the longitudinal axis.
Technical Committee 47F - Micro-electromechanical systems  RSS
ICS Codes
31.080.99 Other semiconductor devices
 
Replaced by
Stability date 2015
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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