Publication detail

Reference

IEC 62453-302 ed1.0

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Title

Field device tool (FDT) interface specification - Part 302: Communication profile integration - IEC 61784 CPF 2

Publication date

2009-06-30

Format, price
(Swiss francs)
and language

	190.-		32 pages
	190.-		1552 Kb

Abstract

IEC 62453-302:2009(E) provides information for integrating the CIP technology into the FDT interface specification (IEC 62453-2). It specifies communication and other services. This specification neither contains the FDT specification nor modifies it. Communication Profile Family 2 (commonly known as CIP^TM1) defines communication profiles based on IEC 61158-2 Type 2, IEC 61158-3-2, IEC 61158-4-2, IEC 61158-5-2, IEC 61158-6-2, and IEC 62026-3. The basic profiles CP 2/1 (ControlNet^TM2), CP 2/2 (EtherNet/IP^TM3), and CP 2/3 (DeviceNet^TM1) are defined in IEC 61784-1 and IEC 61784-2. An additional communication profile (CompoNet^TM1), also based on CIP^TM, is defined in [14].

This publication is to be read in conjunction with IEC 62453-2:2009.

Technical Committee

65E - Devices and integration in enterprise systems

ICS Codes

25.040.40	Industrial process measurement and control
35.100.05	Multilayer applications *Including International Standardized Profiles
35.110	Networking Including local area networks (LAN), metropolitan area networks (MAN), wide area networks (WAN), etc. Private Integrated Services Network (PISN), see 33.040.35 *Integrated Services Digital Network (ISDN), see 33.080

Stability date

2012

Work in progress

Project	Stage code	Forecast publication date
IEC 62453-302 fF Ed.1	BPUB	2013-06-24

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