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Reference IEC 62453-302 ed1.0 withdrawn corrigendum
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Title Field device tool (FDT) interface specification - Part 302: Communication profile integration - IEC 61784 CPF 2
Publication date 2009-06-30
Format, price
(Swiss francs)
and language
190.- 32 pages
190.- 1552 Kb
Abstract IEC 62453-302:2009(E) provides information for integrating the CIP technology into the FDT interface specification (IEC 62453-2). It specifies communication and other services. This specification neither contains the FDT specification nor modifies it. Communication Profile Family 2 (commonly known as CIPTM1) defines communication profiles based on IEC 61158-2 Type 2, IEC 61158-3-2, IEC 61158-4-2, IEC 61158-5-2, IEC 61158-6-2, and IEC 62026-3. The basic profiles CP 2/1 (ControlNetTM2), CP 2/2 (EtherNet/IPTM3), and CP 2/3 (DeviceNetTM1) are defined in IEC 61784-1 and IEC 61784-2. An additional communication profile (CompoNetTM1), also based on CIPTM, is defined in [14].

This publication is to be read in conjunction with IEC 62453-2:2009.
Technical Committee 65E - Devices and integration in enterprise systems  RSS
ICS Codes
25.040.40 Industrial process measurement and control

35.100.05 Multilayer applications
*Including International Standardized Profiles

35.110 Networking
*Including local area networks (LAN), metropolitan area networks (MAN), wide area networks (WAN), etc.
*Private Integrated Services Network (PISN), see 33.040.35
*Integrated Services Digital Network (ISDN), see 33.080
Replaced by
Stability date 2017
Work in progress
ProjectStage codeForecast publication date
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