Publication detail
| Reference | IEC 60191-6 ed3.0 |
 > preview |
||||||||
| Title | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages | |||||||||
| Publication date | 2009-11-26 | |||||||||
| Format, price (Swiss francs) and language |
|
|||||||||
| Abstract | IEC 60191-6:2009 gives general rules for the preparation of outline drawings of surface-mounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8, as well as integrated circuits classified as form E in Clause 3 of IEC 60191-4. This third edition of IEC 60191-6 cancels and replaces the second edition, published in 2004 and constitutes a technical revision. This edition includes the following significant changes with respect to the previous edition: a) scope is modified to cover all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8; b) editorial modifications on several pages; and c) technical revision to ball grid array package (BGA) especially its geometrical drawing format. (two types of BGA would unify as one type as a result of revising drawing format. |
|||||||||
| Technical Committee | 47D - Semiconductor devices packaging
|
|||||||||
| ICS Codes |
|
|||||||||
| Stability date | 2015 | |||||||||
| Work in progress |
|
|||||||||
Search
Quick access by ref. number
Basket
| Your basket is empty |
Payment
| Accepted credit cards: | |
 | Prices in CHF (Swiss francs) |
| Request a pro forma to pay by bank transfer or cheque | |
| Learn how to share your publications with your colleagues, using networking options | |
Just Published
- IEC 60695-11-10 Ed. 2.0
- IEC 61191-1 Ed. 2.0
- IEC 61280-1-1 Ed. 2.0
- Project IEC 62680-1 Ed. 1.0
- Project IEC 61435 Ed. 2.0
- Project IEC 61970-452 Ed. 1.0
- Project IEC 62128-1 Ed. 2.0
>> Published in the last 30 days
Bestsellers