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Reference IEC 60191-6-18 ed1.0 withdrawn corrigendum
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Title Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Publication date 2010-01-07
Format, price
(Swiss francs)
and language
100.- 40 pages
100.- 1163 Kb
 
Abstract IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger. This standard cancels and replaces IEC/PAS 60191-6-18 published in 2008. This first edition constitutes a technical revision. The contents of the corrigenda of May 2010 and July 2010 have been included in this copy.
Technical Committee 47D - Semiconductor devices packaging  RSS
ICS Codes
31.080.01 Semiconductor devices in general
 
Replaced by
Stability date 2014
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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