IEC > Webstore > Search > Register > Check out > Payment > Order confirmation

Publication detail

 
Reference IEC 61191-6 ed1.0 withdrawn corrigendum
> preview
Title Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
Publication date 2010-01-14
Format, price
(Swiss francs)
and language
210.- 76 pages
210.- 2265 Kb
 
Abstract IEC 61191-6:2010 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA soldered on a board. This part of IEC 61191 is not applicable to the BGA package itself before it is assembled on a board. This standard is applicable also to devices having joints made by melt and re-solidification, such as flip chip devices and multi-chip modules, in addition to BGA and LGA. This standard is not applicable to joints with under-fill between a device and a board, or to solder joints within a device package. This standard is applicable to macrovoids of the sizes of from 10 µm to several hundred micrometres generated in a soldered joint, but is not applicable to smaller voids (typically, planar microvoids) with a size of smaller than 10 µm in diameter. This standard is intended for evaluation purposes and is applicable to research studies, off-line production process control and reliability assessment of assembly.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.180 Printed circuits and boards
 
Replaced by
Stability date 2014
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


Search

>> Advanced search

Quick access by ref. number



Basket

Your basket is empty
Your country is :
Your TVA is : You must login...

Payment

Accepted credit cards:
Prices in CHF (Swiss francs)
Request a pro forma to pay by bank transfer or cheque
Learn how to share your publications with your colleagues, using networking options
Prices in CHF (Swiss francs)
We accept the following credit cards:
To pay by bank transfer: request a pro forma
If you purchase regularly through the IEC Webstore you can open a corporate account

Just Published

>> Published in the last 30 days

Bestsellers

  1. IEC 60601-1-2 Ed. 4.0
  2. IEC 60825-1 Ed. 3.0
  3. IEC 61000-4-5 Ed. 3.0
  4. IEC 60092-350 Ed. 4.0
  5. IEC 62304 Ed. 1.0
  6. IEC 60092-354 Ed. 3.0
  7. IEC 60598-1 Ed. 8.0
  8. IEC 62366-am1 Ed. 1.0
  9. IEC 60601-1 Ed. 3.1
  10. IEC 60034-2-1 Ed. 2.0