International Electrotechnical Commission

Publication detail

Reference	IEC 61188-5-8 ed1.0 withdrawn corrigendum	> preview
Title	Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
Publication date	2007-10-30
Format, price (Swiss francs) and language	170.- 61 pages 170.- 1363 Kb
Abstract	IEC 61188-5-8:2007 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints. This publication is to be read in conjunction with IEC 61188-5-1:2002.
Technical Committee	91 - Electronics assembly technology
ICS Codes	31.180 Printed circuits and boards
Replaced by
Stability date	2014
Work in progress	Project Stage code Forecast publication date No project under development - -

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