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Publication detail

 
Reference IEC 61760-3 ed1.0 withdrawn corrigendum
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Title Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering
Publication date 2010-03-16
Format, price
(Swiss francs)
and language
130.- 45 pages
130.- 1243 Kb
 
Abstract IEC 61760-3:2010 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology. The object of this standard is to ensure that components with leads intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this standard defines test and requirements that need to be part of any component generic, sectional or detail specification, when through hole reflow soldering is intended. Further this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole reflow soldering technology.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.190 Electronic component assemblies
*Including preassembled modules
 
Replaced by
Stability date 2017
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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