International Electrotechnical Commission

Publication detail

Reference	IEC 62418 ed1.0 withdrawn corrigendum	> preview
Title	Semiconductor devices - Metallization stress void test
Publication date	2010-04-22
Format, price (Swiss francs) and language	80.- 34 pages 80.- 1025 Kb
Abstract	IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.
Technical Committee	47 - Semiconductor devices
ICS Codes	31.080 Semiconductor devices *Semiconducting materials, see 29.045
Replaced by
Stability date	2015
Work in progress	Project Stage code Forecast publication date No project under development - -

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