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Reference IEC 62615 ed1.0 withdrawn corrigendum
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Title Electrostatic discharge sensitivity testing - Transmission line pulse (TLP) - Component level
Publication date 2010-05-31
Format, price
(Swiss francs)
and language
100.- 38 pages
100.- 1049 Kb
 
Abstract IEC 62615:2010 defines a method for pulse testing to evaluate the voltage current response of the component under test and to consider protection design parameters for electro-static discharge (ESD) human body model (HBM). This technique is known as transmission line pulse (TLP) testing. This document establishes a methodology for both testing and reporting information associated with transmission line pulse (TLP) testing. The scope and focus of this document pertains to TLP testing techniques of semiconductor components. This document should not become alternative method of HBM test standard such as IEC 60749-26. The purpose of the document is to establish guidelines of TLP methods that allow the extraction of HBM ESD parameters on semiconductor devices. This document provides the standard measurement and procedure for the correct extraction of HBM ESD parameters by using TLP.
Technical Committee 47 - Semiconductor devices  RSS
ICS Codes
17.220.99 Other standards related to electricity and magnetism

31.080 Semiconductor devices
*Semiconducting materials, see 29.045
 
Replaced by
Stability date 2016
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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