Publication detail
| Reference | IEC 61190-1-3-am1 ed2.0 |
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| Title | Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications | |||||||||
| Publication date | 2010-06-10 | |||||||||
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| Abstract | ||||||||||
| Technical Committee | 91 - Electronics assembly technology
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| Stability date | 2014 | |||||||||
| Work in progress |
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