International Electrotechnical Commission

Publication detail

Reference	IEC 60191-6-20 ed1.0 withdrawn corrigendum	> preview
Title	Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
Publication date	2010-08-30
Format, price (Swiss francs) and language	45.- 21 pages 45.- 1168 Kb
Abstract	IEC 60191-6-20:2010 specifies methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline form E in accordance with IEC 60191-4.
Technical Committee	47D - Semiconductor devices packaging
ICS Codes	31.080.01 Semiconductor devices in general
Replaced by
Stability date	2016
Work in progress	Project Stage code Forecast publication date No project under development - -

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