International Electrotechnical Commission

Publication detail

Reference	IEC 62374-1 ed1.0 withdrawn corrigendum	> preview
Title	Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
Publication date	2010-09-29
Format, price (Swiss francs) and language	70.- 32 pages 70.- 1105 Kb
Abstract	IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.
Technical Committee	47 - Semiconductor devices
ICS Codes	31.080 Semiconductor devices *Semiconducting materials, see 29.045
Replaced by
Stability date	2015
Work in progress	Project Stage code Forecast publication date No project under development - -

Search

>> Advanced search

Quick access by ref. number

Basket

Your basket is empty

Your country is :
Your TVA is : You must login...

Payment

Just Published

1. IEC 60695-11-10 Ed. 2.0
2. IEC 61191-1 Ed. 2.0
3. IEC 61280-1-1 Ed. 2.0
4. Project IEC 62680-1 Ed. 1.0
5. Project IEC 61435 Ed. 2.0
6. Project IEC 61970-452 Ed. 1.0
7. Project IEC 62128-1 Ed. 2.0

>> Published in the last 30 days

Bestsellers

1. IEC 60529 Ed. 2.1
2. IEC 61000-4-2 Ed. 2.0
3. IEC 62471 Ed. 1.0
4. IEC 60068-2-14 Ed. 6.0
5. IEC 60079-0 Ed. 6.0
6. IEC 60812 Ed. 2.0
7. IEC 61010-1 Ed. 3.0
8. IEC 61400-12-2 Ed. 1.0
9. IEC 60068-2-78 Ed. 2.0
10. IEC 61326-1 Ed. 2.0