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Reference IEC 62374-1 ed1.0 withdrawn corrigendum
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Title Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
Publication date 2010-09-29
Format, price
(Swiss francs)
and language
70.- 32 pages
70.- 1105 Kb
 
Abstract IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.
Technical Committee 47 - Semiconductor devices  RSS
ICS Codes
31.080 Semiconductor devices
*Semiconducting materials, see 29.045
 
Replaced by
Stability date 2015
 
Work in progress
ProjectStage codeForecast publication date
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