IEC > Webstore > Search > Register > Check out > Payment > Order confirmation

Publication detail

Reference P-IEC/PAS 62326-14 ed1.0 withdrawn corrigendum
> preview
Title Printed boards - Part 14: Device embedded substrate - Terminology / reliability / design guide
Publication date 2010-09-29
Format, price
(Swiss francs)
and language
280.- 62 pages
280.- 2017 Kb
Abstract IEC/PAS 62326-14:2010(E) is applicable to device embedded substrates fabricated by embedding discrete active and passive electronic devices into an inner layer of a substrate with electric connections by vias, conductor plating, conductive paste, and printing. The device embedded substrate may be used as a substrate to mount SMDs to form electronic circuits, as conductor and insulator layers may be formed after embedding electronic devices. The purpose of this PAS is to obtain common understanding in design, fabrication and use of device embedded substrates in the industry. This PAS describes the substrate embedding devices including but not limited to module, integrated passive device (IPD), microelectrochemical systems (MEMS), discrete component formed in the fabrication process of the electronic wiring board, and sheet form component. This PAS does not specify the fabrication process of device embedded substrates, via diameter/via land diameter, conductor width/conductor spacing nor conductor line density.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.180 Printed circuits and boards
Replaced by Withdrawn


>> Advanced search

Quick access by ref. number


Your basket is empty
Your country is :
Your TVA is : You must login...


Accepted credit cards:
Prices in CHF (Swiss francs)
Request a pro forma to pay by bank transfer or cheque
Learn how to share your publications with your colleagues, using networking options
Prices in CHF (Swiss francs)
We accept the following credit cards:
To pay by bank transfer: request a pro forma
If you purchase regularly through the IEC Webstore you can open a corporate account

Just Published

>> Published in the last 30 days


  1. IEC 60601-1-2 Ed. 4.0
  2. IEC 61010-1 Ed. 3.0
  3. IEC 60601-1 Ed. 3.1
  4. IEC 61508-3 Ed. 2.0
  5. IEC 60079-0 Ed. 6.0
  6. IEC 61000-4-5 Ed. 3.0
  7. IEC 61000-4-2 Ed. 2.0
  8. IEC 60079-1 Ed. 7.0
  9. IEC 60529 Ed. 2.2
  10. IEC 61162-1 Ed. 4.0