Publication detail
| Reference | IEC 60749-15 ed2.0 |
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| Title | Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices | |||||||||
| Publication date | 2010-10-28 | |||||||||
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| Abstract | IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include: - editorial change in the scope; - addition of lead-free solder chemical composition specification. |
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| Technical Committee | 47 - Semiconductor devices
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| Stability date | 2015 | |||||||||
| Work in progress |
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